Effect of deposition processes on residual stress profiles along the thickness in (Ti,Al)N films
文献类型：期刊论文
| 作者 | S. S. Zhao ; Y. Yang ; J. B. Li ; J. Gong ; C. Sun |
| 刊名 | Surface & Coatings Technology
 |
| 出版日期 | 2008 |
| 卷号 | 202期号:21页码:5185-5189 |
| 关键词 | arc ion plating (Ti stress distribution Al)N sputtered hard coatings pvd coatings adhesion strength thin-films bias |
| ISSN号 | 0257-8972 |
| 中文摘要 | The effect of deposition processes on the distribution of residual stresses in the thickness of the (Ti,Al)N films prepared by arc ion plating (AlP) was investigated in the present work, which indicates that the stress distribution exhibits a "bell" shape and the maximum compressive stress appears in the layer near the surface. The residual stress increases with the thickness of a film and the substrate bias voltage, respectively. The stress distribution can be altered, and the adhesion of the film/substrate can be improved by optimizing the deposition parameters. Finally, a film with a thickness of 7.57 mu m was successfully directly deposited on the substrate through optimizing the bias voltage. (C) 2008 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33372]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | S. S. Zhao,Y. Yang,J. B. Li,et al. Effect of deposition processes on residual stress profiles along the thickness in (Ti,Al)N films[J]. Surface & Coatings Technology,2008,202(21):5185-5189. |
| APA | S. S. Zhao,Y. Yang,J. B. Li,J. Gong,&C. Sun.(2008).Effect of deposition processes on residual stress profiles along the thickness in (Ti,Al)N films.Surface & Coatings Technology,202(21),5185-5189. |
| MLA | S. S. Zhao,et al."Effect of deposition processes on residual stress profiles along the thickness in (Ti,Al)N films".Surface & Coatings Technology 202.21(2008):5185-5189. |
入库方式： OAI收割
来源：金属研究所
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