Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint
文献类型：期刊论文
| 作者 | H. F. Zou ; Q. S. Zhu ; Z. F. Zhang |
| 刊名 | Journal of Alloys and Compounds
 |
| 出版日期 | 2008 |
| 卷号 | 461期号:1-2页码:410-417 |
| 关键词 | Ag single crystal substrate Sn-3.8Ag-0.7Cu solder intermetallic compounds (IMCs) growth kinetics tensile strength fracture lead-free solder interfacial reaction cu-substrate microstructure metallization sn-3.5ag bump ni strength pb |
| ISSN号 | 0925-8388 |
| 中文摘要 | The growth kinetics and interfacial morphologies of intermetallic compounds (IMCs) and tensile properties of single crystal Ag/Sn-3.8Ag-0.7Cu (SAC) solder joint were investigated by solid-state aging at 170 degrees C and liquid-state aging at 250 degrees C. It is found that the growth kinetics of IMCs under both solid- and liquid-state aging conditions follow parabola relationship. Accordingly, the diffusion coefficients under the two conditions were calculated to be about 2.50 x 10(-17) m(2) s(-1) and 1.60 x 10(-14) m(2) s(-1), respectively. With increasing aging time, the scallop-like morphology of the IMC gradually evolved into planar type after solid-state aging; but it became rougher after liquid-state aging. Meanwhile, the average grain size of IMC also increases with increasing aging time. The tensile strength of the Sn-Ag-Cu/Ag single crystal joints did not decrease seriously with increasing aging time and the corresponding tensile fracture mechanism was discussed. (c) 2007 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://210.72.142.130/handle/321006/33421]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. F. Zou,Q. S. Zhu,Z. F. Zhang. Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint[J]. Journal of Alloys and Compounds,2008,461(1-2):410-417. |
| APA | H. F. Zou,Q. S. Zhu,&Z. F. Zhang.(2008).Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint.Journal of Alloys and Compounds,461(1-2),410-417. |
| MLA | H. F. Zou,et al."Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint".Journal of Alloys and Compounds 461.1-2(2008):410-417. |
入库方式： OAI收割
来源：金属研究所
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