Investigation of thermal expansion of PI/SiO2 composite films by CCD imaging technique from - 120 to 200 degrees C
文献类型：期刊论文
| 作者 | X. G. Chen ; J. D. Guo ; B. Zheng ; Y. Q. Li ; S. Y. Fu ; G. H. He |
| 刊名 | Composites Science and Technology
 |
| 出版日期 | 2007 |
| 卷号 | 67期号:14页码:3006-3013 |
| 关键词 | silica/polyimide composite film thermal expansion CCD imaging technique low temperature elevated temperature mechanical-properties cryogenic properties nanocomposite films polyimide films low-temperature silica |
| ISSN号 | 0266-3538 |
| 中文摘要 | The thermal expansion of the reference sample, pure copper film in the temperature range of - 120 to 200 degrees C was first measured using the newly improved CCD imaging technique for measurement of thermal expansion of thin films. The results showed good accordance with the recommended data given by TPRC (Thermophysical Properties Research Centre, USA) handbook, verifying that the present method is valid for measuring thermal expansion of films. Then, the thermal expansion TE (Delta L/L-0) of silica/polyimide composite films with different SiO2 fractions i.e. 0, 1, 3, 5, 8, 10 and 15 wt% prepared using the sol-gel technique was obtained in the temperature range of - 120 to 200 degrees C using the newly improved CCD method and the differential coefficient thermal expansion (CTE) can be deduced by Delta L/L-0 similar to temperature relation. The CTE Of SiO2/PI Composite films decreased with the increase Of SiO2 content and the decrease of temperature. An empirical equation of CTE of SiO2/PI with SiO2, content has been given in this paper. (C) 2007 Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/33458]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. G. Chen,J. D. Guo,B. Zheng,et al. Investigation of thermal expansion of PI/SiO2 composite films by CCD imaging technique from - 120 to 200 degrees C[J]. Composites Science and Technology,2007,67(14):3006-3013. |
| APA | X. G. Chen,J. D. Guo,B. Zheng,Y. Q. Li,S. Y. Fu,&G. H. He.(2007).Investigation of thermal expansion of PI/SiO2 composite films by CCD imaging technique from - 120 to 200 degrees C.Composites Science and Technology,67(14),3006-3013. |
| MLA | X. G. Chen,et al."Investigation of thermal expansion of PI/SiO2 composite films by CCD imaging technique from - 120 to 200 degrees C".Composites Science and Technology 67.14(2007):3006-3013. |
入库方式： OAI收割
来源：金属研究所
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