Degradation of solderability of electroless nickel by phosphide particles
文献类型：期刊论文
| 作者 | J. J. Guo ; A. P. Man ; J. K. Shang |
| 刊名 | Surface & Coatings Technology
 |
| 出版日期 | 2007 |
| 卷号 | 202期号:2页码:268-274 |
| 关键词 | solderability electroless nickel wetting Pb-free solder SnAgCu alloy lead-free solders state interfacial reaction ni-plated kovar ag-cu solders intermetallic compounds mechanical-properties bump metallization microstructure copper wettability |
| ISSN号 | 0257-8972 |
| 中文摘要 | Wetting of electroless nickel by the eutectic SnAgCu solder alloy was investigated in the as-deposited and annealed conditions. In the as-deposited state, P content in the nickel had a minimal effect on the solderability of the electroless nickel. Upon annealing, numerous nickel phosphide particles precipitated out of the electroless nickel with a high-P content. The presence of these phosphide precipitates reduced the solderability of the electroless nickel both in terms of the wetting force and wetting kinetics. While weakening in the wetting force is related to the inferior contact condition, the slower wetting kinetics is explained in terms of the reduction in the dissolution rate of the electroless nickel from non-soluble phosphide particles. (c) 2007 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/33558]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. J. Guo,A. P. Man,J. K. Shang. Degradation of solderability of electroless nickel by phosphide particles[J]. Surface & Coatings Technology,2007,202(2):268-274. |
| APA | J. J. Guo,A. P. Man,&J. K. Shang.(2007).Degradation of solderability of electroless nickel by phosphide particles.Surface & Coatings Technology,202(2),268-274. |
| MLA | J. J. Guo,et al."Degradation of solderability of electroless nickel by phosphide particles".Surface & Coatings Technology 202.2(2007):268-274. |
入库方式： OAI收割
来源：金属研究所
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