Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder
文献类型：期刊论文
| 作者 | J. J. Guo ; L. Zhang ; A. P. Xian ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2007 |
| 卷号 | 23期号:6页码:811-816 |
| 关键词 | solderability FeNi alloys lead-free solders wetting electroless-nickel/solder interface enig plating layer thermal-stability sn-0.4cu solder cu substrate plated kovar sn reflow copper part |
| ISSN号 | 1005-0302 |
| 中文摘要 | Solderabilities of electrodeposited Fe-Ni alloys with SnAgCu solder were examined by wetting balance measurements and compared to those of pure Ni and pure Fe platings. Excellent solderability was found on the Ni-52Fe plating as both the wetting force and kinetics approached or exceeded those on the pure Ni. However, upon further increase in Fe content to 75 at. pct, the solderability of the alloy was severely degraded even though it was still better than that of the pure Fe plating. X-ray photoelectron spectroscopy showed that such a strong dependence of solderability on Fe content is related to the much thinner, incomplete oxide coverage of Ni-rich plating surface. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/33559]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | J. J. Guo,L. Zhang,A. P. Xian,et al. Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder[J]. Journal of Materials Science & Technology,2007,23(6):811-816. |
| APA | J. J. Guo,L. Zhang,A. P. Xian,&J. K. Shang.(2007).Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder.Journal of Materials Science & Technology,23(6),811-816. |
| MLA | J. J. Guo,et al."Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder".Journal of Materials Science & Technology 23.6(2007):811-816. |
入库方式： OAI收割
来源：金属研究所
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