Fatigue and thermal fatigue damage analysis of thin metal films
文献类型：期刊论文
| 作者 | G. P. Zhang ; C. A. Volkert ; R. Schwaiger ; R. Monig ; O. Kraft |
| 刊名 | Microelectronics Reliability
 |
| 出版日期 | 2007 |
| 卷号 | 47期号:12页码:2007-2013 |
| 关键词 | high-cycle fatigue copper-films mechanical-properties behavior size deformation specimens tension |
| ISSN号 | 0026-2714 |
| 中文摘要 | In this paper, we summarize several testing methods that are currently available for the characterization of fatigue properties of thin metal films. Using these testing methods, a number of experimental investigations of the fatigue and thermal fatigue of metal films with thicknesses ranging from micrometers to sub-micrometers are described. Extensive experimental observations as well as theoretical analyses reveal that the damage behavior, i.e. typical fatigue extrusions and cracking, are quite different from that of bulk materials, and are controlled by the length scales of the materials. Due to the high surface to volume ratio of thin films interface-induced and diffusion-related damage are prevalent in these small length scale materials. As a result, interfaces pose a serious threat to the reliability of thin films. (c) 2007 Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34021]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | G. P. Zhang,C. A. Volkert,R. Schwaiger,et al. Fatigue and thermal fatigue damage analysis of thin metal films[J]. Microelectronics Reliability,2007,47(12):2007-2013. |
| APA | G. P. Zhang,C. A. Volkert,R. Schwaiger,R. Monig,&O. Kraft.(2007).Fatigue and thermal fatigue damage analysis of thin metal films.Microelectronics Reliability,47(12),2007-2013. |
| MLA | G. P. Zhang,et al."Fatigue and thermal fatigue damage analysis of thin metal films".Microelectronics Reliability 47.12(2007):2007-2013. |
入库方式： OAI收割
来源：金属研究所
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