Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect
文献类型：期刊论文
| 作者 | X. F. Zhang ; J. D. Guo ; J. K. Shang |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2007 |
| 卷号 | 57期号:6页码:513-516 |
| 关键词 | abnormal polarity effect electromigration intermetallic compound |
| ISSN号 | 1359-6462 |
| 中文摘要 | Interfacial reactions in a eutectic Sn-Zn solder/Cu interconnect were investigated under electric current stressing. After applying a constant direct current at 4.26 x 10(4) A cm(-2) for 166 h, an abnormal "polarity effect" was found where the intermetallic compound layer at the cathode was about 2.3 mu m thicker than that at the anode. Upon increasing the temperature to about 185 degrees C, Cu-Zn compounds were replaced by Cu-Sn compounds at the anode and by a mixture of Cu-Zn and Cu-Sn compounds at the cathode. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34051]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. F. Zhang,J. D. Guo,J. K. Shang. Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect[J]. Scripta Materialia,2007,57(6):513-516. |
| APA | X. F. Zhang,J. D. Guo,&J. K. Shang.(2007).Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect.Scripta Materialia,57(6),513-516. |
| MLA | X. F. Zhang,et al."Abnormal polarity effect of electromigration on intermetallic compound formation in Sn-9Zn solder interconnect".Scripta Materialia 57.6(2007):513-516. |
入库方式： OAI收割
来源：金属研究所
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