中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
On the Hall-Petch relation between flow stress and grain size

文献类型:期刊论文

作者W. Blum
刊名International Journal of Materials Research
出版日期2006
卷号97期号:12页码:1661-1666
关键词flow stress ultra fine grains Hall-Petch nanocrystalline cu creep deformation temperature copper
ISSN号1862-5282
中文摘要Data of flow stresses a for pure Cu with ultrafine grains with grain size d approximate to 0.35 mu m produced by severe plastic deformation and grains of conventional size obtained in the range of homologous temperatures T-hom from 0.22 (room temperature) to 0.33 are compared to data for hardnesses H for Cu of various grain structures from single crystalline to d = 0.01 mu m measured by nanoindentation at room temperature. The two sets of data appear to be consistent when sigma approximate to H/3. At room temperature the Hall-Petch relation holds, i.e., the flow stress increases monotonically with decreasing grain size by Delta sigma alpha d(-0.5). At elevated T-hom the saturated flow stress decreases when the grains become ultrafine. The transition from hardening to softening by grain boundaries in the saturation stage is discussed on the basis of a simple statistical dislocation model considering the influence of grain boundaries on the balance between generation and annihilation of dislocations.
原文出处://WOS:000243356300007
公开日期2012-04-13
源URL[http://ir.imr.ac.cn/handle/321006/34129]  
专题金属研究所_中国科学院金属研究所
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GB/T 7714
W. Blum. On the Hall-Petch relation between flow stress and grain size[J]. International Journal of Materials Research,2006,97(12):1661-1666.
APA W. Blum.(2006).On the Hall-Petch relation between flow stress and grain size.International Journal of Materials Research,97(12),1661-1666.
MLA W. Blum."On the Hall-Petch relation between flow stress and grain size".International Journal of Materials Research 97.12(2006):1661-1666.

入库方式: OAI收割

来源:金属研究所

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