On the Hall-Petch relation between flow stress and grain size
文献类型：期刊论文
| 作者 | W. Blum |
| 刊名 | International Journal of Materials Research
 |
| 出版日期 | 2006 |
| 卷号 | 97期号:12页码:1661-1666 |
| 关键词 | flow stress ultra fine grains Hall-Petch nanocrystalline cu creep deformation temperature copper |
| ISSN号 | 1862-5282 |
| 中文摘要 | Data of flow stresses a for pure Cu with ultrafine grains with grain size d approximate to 0.35 mu m produced by severe plastic deformation and grains of conventional size obtained in the range of homologous temperatures T-hom from 0.22 (room temperature) to 0.33 are compared to data for hardnesses H for Cu of various grain structures from single crystalline to d = 0.01 mu m measured by nanoindentation at room temperature. The two sets of data appear to be consistent when sigma approximate to H/3. At room temperature the Hall-Petch relation holds, i.e., the flow stress increases monotonically with decreasing grain size by Delta sigma alpha d(-0.5). At elevated T-hom the saturated flow stress decreases when the grains become ultrafine. The transition from hardening to softening by grain boundaries in the saturation stage is discussed on the basis of a simple statistical dislocation model considering the influence of grain boundaries on the balance between generation and annihilation of dislocations. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34129]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | W. Blum. On the Hall-Petch relation between flow stress and grain size[J]. International Journal of Materials Research,2006,97(12):1661-1666. |
| APA | W. Blum.(2006).On the Hall-Petch relation between flow stress and grain size.International Journal of Materials Research,97(12),1661-1666. |
| MLA | W. Blum."On the Hall-Petch relation between flow stress and grain size".International Journal of Materials Research 97.12(2006):1661-1666. |
入库方式： OAI收割
来源：金属研究所
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