Electroless Ni-P coating preparation of conductive mica powder by a modified activation process
文献类型：期刊论文
| 作者 | H. B. Dai ; H. X. Li ; F. H. Wang |
| 刊名 | Applied Surface Science
 |
| 出版日期 | 2006 |
| 卷号 | 253期号:5页码:2474-2480 |
| 关键词 | electroless Ni-P coating conductive powder mica activation metal-deposition silane adsorption ligands metallization monolayers mechanism surfaces features fiber |
| ISSN号 | 0169-4332 |
| 中文摘要 | A modified activation process was developed for electroless Ni-P coating preparation of conductive mica powder. The electroless Ni-P coating process was modified by replacing the conventional sensitization and activation steps only using activation step with a Pd(II)-APTHS activator, which is a complex of Pd(II) ion with a derivate gamma-aminopropyttrihydroxysilane (APTHS) from the hydrolysis of gamma-aminopropyltriethoxysilane (APTES). The activated reaction progress and resulted Ni-P coating were characterized by XPS, SEM/EDX and TEM. Electroless nickel deposition was successfully initiated by this activation process. This activation process is very simple, and the obtained Ni-P deposits have the advantages of uniformity, continuity and densification. The average specific resistivity for the Ni-P coated mica powder was 4.85 x 10(-2) ohm cm. (c) 2006 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34165]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | H. B. Dai,H. X. Li,F. H. Wang. Electroless Ni-P coating preparation of conductive mica powder by a modified activation process[J]. Applied Surface Science,2006,253(5):2474-2480. |
| APA | H. B. Dai,H. X. Li,&F. H. Wang.(2006).Electroless Ni-P coating preparation of conductive mica powder by a modified activation process.Applied Surface Science,253(5),2474-2480. |
| MLA | H. B. Dai,et al."Electroless Ni-P coating preparation of conductive mica powder by a modified activation process".Applied Surface Science 253.5(2006):2474-2480. |
入库方式： OAI收割
来源：金属研究所
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