Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation
文献类型：期刊论文
| 作者 | C. Z. Liu ; J. Chen ; P. L. Liu ; J. K. Shang |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2006 |
| 卷号 | 22期号:1页码:130-134 |
| 关键词 | solder interconnect nanoindentation creep deformation lead-free solders sn-ag creep temperature tin pb segregation behavior fatigue bismuth |
| ISSN号 | 1005-0302 |
| 中文摘要 | Nanoindentation was used to probe softening of the eutectic microstructure in a SnBi/Cu interconnect following thermal aging. Tests were conducted at constant loading rates and under constant loads to characterize the flow stress and creep behavior of the eutectic microstructure. Aging was found to reduce the flow stress but to increase strain-rate sensitivity of the eutectic SnBi microstructure. While the reduction in the flow stress was related to the coarsening of the eutectic microstructure, the increased creep rate sensitivity was resulted from additional contribution of grain boundary movement to indentation creep. |
| 原文出处 | |
| 公开日期 | 2012-04-13 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34343]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | C. Z. Liu,J. Chen,P. L. Liu,et al. Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation[J]. Journal of Materials Science & Technology,2006,22(1):130-134. |
| APA | C. Z. Liu,J. Chen,P. L. Liu,&J. K. Shang.(2006).Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation.Journal of Materials Science & Technology,22(1),130-134. |
| MLA | C. Z. Liu,et al."Investigation on aging-induced softening of eutectic microstructure in SnBi/Cu interconnect by nanoindentation".Journal of Materials Science & Technology 22.1(2006):130-134. |
入库方式： OAI收割
来源：金属研究所
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