Strain rate sensitivity of Cu with nanoscale twins
文献类型：期刊论文
| 作者 | Y. F. Shen ; L. Lu ; M. Dao ; S. Suresh |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2006 |
| 卷号 | 55期号:4页码:319-322 |
| 关键词 | nanocrystalline materials copper nanoscale twins pulsed electrodeposition strain rate sensitivity nano-scale twins activation volume mechanical-properties nanocrystalline cu tensile properties flow-stress metals copper deformation alloys |
| ISSN号 | 1359-6462 |
| 中文摘要 | The strain-rate sensitivity of ultrafine-crystalline Cu with different concentrations of nanoscale growth twins is investigated using tensile strain rate jump tests. Higher twin density leads to enhanced rate sensitivity, which decreases mildly with increasing strain rate and strain. Mechanisms underlying these effects are explored through post-deformation transmission electron microscopy. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34454]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. F. Shen,L. Lu,M. Dao,et al. Strain rate sensitivity of Cu with nanoscale twins[J]. Scripta Materialia,2006,55(4):319-322. |
| APA | Y. F. Shen,L. Lu,M. Dao,&S. Suresh.(2006).Strain rate sensitivity of Cu with nanoscale twins.Scripta Materialia,55(4),319-322. |
| MLA | Y. F. Shen,et al."Strain rate sensitivity of Cu with nanoscale twins".Scripta Materialia 55.4(2006):319-322. |
入库方式： OAI收割
来源：金属研究所
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