中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD

文献类型:期刊论文

作者M. Yu ; J. Z. Zhang ; D. X. Li ; Q. L. Meng ; W. Z. Li
刊名Surface & Coatings Technology
出版日期2006
卷号201期号:3-4页码:1243-1249
关键词MEVVA IBAD copper film compressive stress adhesion deposited thin-films intrinsic stress residual-stress cosi2 films bombardment diamond
ISSN号0257-8972
中文摘要Three groups of copper films were deposited on the surfaces of the Si (100) crystal by both metal vapor vacuum arc (MEVVA) ion implantation and ion beam assistant deposition (IBAD) technologies. Before coating Cu film by IBAD two groups of the samples were implanted by 68keV Cu ion with fluence of 3 x 10(17) ion s/cm(2). Different sputtering ion densities and deposition times of IBAD were selected for three groups of the samples. The internal stresses in the copper films were analyzed by X-ray diffraction (XRD). The morphologies of the copper films and cross-section micrographs were observed by scanning electron microscopy (SEM). The adhesive strength of the Cu films was measured by a nano indenter. The experimental data indicate that all the copper films possessed compressive stress, which was increased as the film thickness increased. The internal stresses of the samples prepared without Cu ion implantation were minimum among three groups of the samples. The adhesive strength of the samples prepared with MEVVA ion implantation was much higher than one of the samples prepared without MEVVA ion implantation. (c) 2006 Elsevier B.V. All rights reserved.
原文出处://WOS:000244477300101
公开日期2012-04-14
源URL[http://ir.imr.ac.cn/handle/321006/34671]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
M. Yu,J. Z. Zhang,D. X. Li,et al. Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD[J]. Surface & Coatings Technology,2006,201(3-4):1243-1249.
APA M. Yu,J. Z. Zhang,D. X. Li,Q. L. Meng,&W. Z. Li.(2006).Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD.Surface & Coatings Technology,201(3-4),1243-1249.
MLA M. Yu,et al."Internal stress and adhesion of Cu film/Si prepared by both MEVVA and IBAD".Surface & Coatings Technology 201.3-4(2006):1243-1249.

入库方式: OAI收割

来源:金属研究所

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