Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07
文献类型：期刊论文
| 作者 | Q. S. Zhu ; Z. F. Zhang ; J. K. Shang ; Z. Wang |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2006 |
| 卷号 | 435页码:588-594 |
| 关键词 | Sn-Ag-Cu solder copper single crystal intermetallic compounds (IMCs) interface cyclic deformation persistent slip bands (PSBs) fatigue cracking persistent slip bands pb-free solders intermetallic compounds cyclic deformation joints behavior growth microstructure evolution strength |
| ISSN号 | 0921-5093 |
| 中文摘要 | Sn-Ag-Cu solder/copper single crystal joints were prepared to reveal the interfacial fatigue damage mechanisms. Scallop-type CU6Sn5 and planar-type CU6Sn5/CU3Sn intermetallic compounds (IMCs) interfaces were formed between SnAgCu solder and copper single crystal after re-flowing at 240 degrees C and subsequent aging at 170 degrees C, respectively. Under cyclic loading, persistent slip bands (PSBs) were activated in copper single crystal and continuously impinged the interfaces of the SnAgCu solder/copper single crystal joint. Two types of fatigue cracking modes, i.e. interfacial cracking between solder and IMC and fracture within IMC, were observed. Based on the experimental observations above, the corresponding interfacial fatigue cracking mechanisms were discussed. (c) 2006 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34781]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. S. Zhu,Z. F. Zhang,J. K. Shang,et al. Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2006,435:588-594. |
| APA | Q. S. Zhu,Z. F. Zhang,J. K. Shang,&Z. Wang.(2006).Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,435,588-594. |
| MLA | Q. S. Zhu,et al."Fatigue damage mechanisms of copper single crystal/Sn-Ag-Cu interfaces 10.1016/j.msea.2006.07".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 435(2006):588-594. |
入库方式： OAI收割
来源：金属研究所
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