中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures

文献类型:期刊论文

作者X. W. Li ; S. D. Wu ; Y. Wu ; H. Y. Yasuda ; Y. Umakoshi
刊名Materials Transactions
出版日期2005
卷号46期号:12页码:3077-3080
关键词ultrafine-grained copper equal channel angular pressing cyclic deformation high temperature shear bands dislocation slip recrystallization severe plastic-deformation boundary migration single-crystals shear bands fatigue aluminum ecap
ISSN号1345-9678
中文摘要The surface deformation features in ultrafine-grained copper produced by equal channel angular (ECA) pressing. which was cyclically deformed at temperatures between room temperature and 573 K under a constant stress amplitude of 200 MPa, were investigated. It was found that the surface deformation features and damage behaviour are strongly dependent upon the testing temperature. For examples, large-scale shear bands (SBs) formed at room temperature, whereas finer and discontinuous S13s, instead of large-scale SBs. were found to become the dominant feature with increasing temperature (below recrystallization), resulting from the reduction in quantity and volume fraction of grain boundaries as a consequence of grain growth and the enhanced dislocation slip. When the temperature is above recrystallization, no clear SBs were observed and dislocation slip deformation within grains governed the plastic deformation of UFG copper. causing nucleation of cracks along slip bands in grains or along grain boundaries, in contrast to the nucleation along SBs at temperatures below recrystallization.
原文出处://WOS:000234846500092
公开日期2012-04-14
源URL[http://ir.imr.ac.cn/handle/321006/34907]  
专题金属研究所_中国科学院金属研究所
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GB/T 7714
X. W. Li,S. D. Wu,Y. Wu,et al. Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures[J]. Materials Transactions,2005,46(12):3077-3080.
APA X. W. Li,S. D. Wu,Y. Wu,H. Y. Yasuda,&Y. Umakoshi.(2005).Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures.Materials Transactions,46(12),3077-3080.
MLA X. W. Li,et al."Surface deformation features in ultrafine-grained copper cyclically stressed at different temperatures".Materials Transactions 46.12(2005):3077-3080.

入库方式: OAI收割

来源:金属研究所

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