Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing
文献类型：期刊论文
| 作者 | X. W. Li ; S. D. Wu ; Y. Wu ; H. Y. Yasuda ; Y. Umakoshi |
| 刊名 | Advanced Engineering Materials
 |
| 出版日期 | 2005 |
| 卷号 | 7期号:9页码:829-833 |
| ISSN号 | 1438-1656 |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/34908]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | X. W. Li,S. D. Wu,Y. Wu,et al. Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing[J]. Advanced Engineering Materials,2005,7(9):829-833. |
| APA | X. W. Li,S. D. Wu,Y. Wu,H. Y. Yasuda,&Y. Umakoshi.(2005).Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing.Advanced Engineering Materials,7(9),829-833. |
| MLA | X. W. Li,et al."Temperature-dependent microstructures in fatigued ultrafine-grained copper produced by equal channel angular pressing".Advanced Engineering Materials 7.9(2005):829-833. |
入库方式： OAI收割
来源：金属研究所
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