Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite
文献类型:期刊论文
作者 | J. Y. Wu ; Y. C. Zhou ; J. Y. Wang ; W. Wang ; C. K. Yan |
刊名 | Zeitschrift Fur Metallkunde
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出版日期 | 2005 |
卷号 | 96期号:11页码:1314-1320 |
关键词 | interface copper Ti2SnC metal matrix composites dispersion-strengthened copper mechanical-properties ti3sic2 behavior stability |
ISSN号 | 0044-3093 |
中文摘要 | Interfacial reaction between Cu and Ti2SnC during the processing of Cu - Ti2SnC composite was investigated by using X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. It is shown that the reaction is closely related to the reaction temperature, reaction time, and relative ratio of Cu and Ti2SnC. The reacting products are Cu(Sn) solid solution and TiCx, and the transporting process during interfacial reaction is described. The interfacial reaction products are further confirmed by measuring the hardness across the interface using nanoindentation test. It is shown that the reaction is controlled by the de-intercalation of Sn from Ti2SnC to form Cu(Sn) solid solution and TiCx, and crystallographic relations of [011] TiCx // [010] Ti2SnC and (111) TiCx // (001) Ti2SnC were observed at the interface. The effect of interfacial reaction on the mechanical and electrical properties of the composite is also discussed. |
原文出处 | |
公开日期 | 2012-04-14 |
源URL | [http://ir.imr.ac.cn/handle/321006/35113] ![]() |
专题 | 金属研究所_中国科学院金属研究所 |
推荐引用方式 GB/T 7714 | J. Y. Wu,Y. C. Zhou,J. Y. Wang,et al. Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite[J]. Zeitschrift Fur Metallkunde,2005,96(11):1314-1320. |
APA | J. Y. Wu,Y. C. Zhou,J. Y. Wang,W. Wang,&C. K. Yan.(2005).Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite.Zeitschrift Fur Metallkunde,96(11),1314-1320. |
MLA | J. Y. Wu,et al."Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite".Zeitschrift Fur Metallkunde 96.11(2005):1314-1320. |
入库方式: OAI收割
来源:金属研究所
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