Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure
文献类型：期刊论文
| 作者 | Q. L. Zeng ; Z. G. Wang ; A. P. Xian ; J. K. Shang |
| 刊名 | Journal of Electronic Materials
 |
| 出版日期 | 2005 |
| 卷号 | 34期号:1页码:62-67 |
| 关键词 | lead-free solder low-cycle fatigue cyclic softening Sn-3.8Ag-0.7Cu alloy sn-ag-cu fatigue behavior bi |
| ISSN号 | 0361-5235 |
| 中文摘要 | Low-cycle fatigue behavior of the Sn-Ag-Cu ternary-eutectic alloy was investigated under a fully reversed loading condition. The solder alloy exhibited cyclic softening early in the fatigue life and continued to soften as the number of fatigue cycles increased. Following cyclic loading, numerous microcracks were found in the microstructure. Most of the microcracks were located along the grain boundaries in the areas with finer grains. The areal density of the microcracks increased with both strain amplitude and cycle number. By combining percolation theory with microcracking analysis, the cycle-dependent softening behavior: was shown to result from accumulation of microcrack density with fatigue cycles. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/35193]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Q. L. Zeng,Z. G. Wang,A. P. Xian,et al. Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure[J]. Journal of Electronic Materials,2005,34(1):62-67. |
| APA | Q. L. Zeng,Z. G. Wang,A. P. Xian,&J. K. Shang.(2005).Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure.Journal of Electronic Materials,34(1),62-67. |
| MLA | Q. L. Zeng,et al."Cyclic softening of the Sn-3.8Ag-0.7Cu lead-free solder alloy with equiaxed grain structure".Journal of Electronic Materials 34.1(2005):62-67. |
入库方式： OAI收割
来源：金属研究所
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