中国科学院机构知识库网格
Chinese Academy of Sciences Institutional Repositories Grid
Damage behavior of 200-nm thin copper films under cyclic loading

文献类型:期刊论文

作者G. P. Zhang ; C. A. Volkert ; R. Schwaiger ; E. Arzt ; O. Kraft
刊名Journal of Materials Research
出版日期2005
卷号20期号:1页码:201-207
关键词crack initiation fatigue behavior single-crystals metal-films dislocation-structures grain-size deformation compression thickness tension
ISSN号0884-2914
中文摘要Fatigue damage in 200-nm-thick Cu films was investigated and compared with the damage in thicker Cu films. The fatigued 200-nm-thick Cu films exhibited only a few, small extrusions and extensive cracking along twin and grain boundaries, whereas the thicker films showed many extrusions/intrusions and cracks lying along the extrusions rather than along the boundaries. This change in fatigue damage behavior with film thickness is attributed to the inhibition of dislocation mobility and the limited availability and activation of dislocation sources on the small length scale. It is argued that the decrease in film thickness and grain size inhibits the localized accumulation of plastic strain within grains, such as at extrusions/intrusions and in extended dislocation structures, and promotes the formation of damage such as cracks at twin and grain boundaries during fatigue. This effect is suggested as the likely cause for the increase in fatigue life with decreasing specimen dimensions.
原文出处://WOS:000229292600027
公开日期2012-04-14
源URL[http://ir.imr.ac.cn/handle/321006/35204]  
专题金属研究所_中国科学院金属研究所
推荐引用方式
GB/T 7714
G. P. Zhang,C. A. Volkert,R. Schwaiger,et al. Damage behavior of 200-nm thin copper films under cyclic loading[J]. Journal of Materials Research,2005,20(1):201-207.
APA G. P. Zhang,C. A. Volkert,R. Schwaiger,E. Arzt,&O. Kraft.(2005).Damage behavior of 200-nm thin copper films under cyclic loading.Journal of Materials Research,20(1),201-207.
MLA G. P. Zhang,et al."Damage behavior of 200-nm thin copper films under cyclic loading".Journal of Materials Research 20.1(2005):201-207.

入库方式: OAI收割

来源:金属研究所

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