The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary
文献类型：期刊论文
| 作者 | Y. Li ; S. X. Li ; G. Y. Li |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2004 |
| 卷号 | 372期号:1-2页码:221-228 |
| 关键词 | cyclic deformation grain boundary copper bicrystal crack tip deformation band persistent slip band persistent slip bands stage-i propagation high strain fatigue single-crystals initiation nucleation polycrystals amplitudes mechanisms morphology |
| ISSN号 | 0921-5093 |
| 中文摘要 | Cyclic deformation of a copper bicrystal with perpendicular grain boundary (GB) has been performed at room temperature at a constant plastic strain amplitude of 1.5 x 10(-3). The dislocation structure evolution in typical deformation band (DB) as opposed to persistent slip bands (PSB) was observed by electron channelling contrast technique in the scanning electron microscope (SEM) at different cycles. It was found that a micro-crack nucleated preferentially at the interface between matrix and the second type of deformation band (DBII), the habit plane of which is close to the conventional kink plane {1 0 1}, in the vicinity of grain boundary (GB), and propagated along DBII. The dislocation structures of the transgranular and intergranular crack tip were also observed. The main dislocation structure near the crack tip is the cell structure. (C) 2003 Elsevier B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/35426]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | Y. Li,S. X. Li,G. Y. Li. The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2004,372(1-2):221-228. |
| APA | Y. Li,S. X. Li,&G. Y. Li.(2004).The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,372(1-2),221-228. |
| MLA | Y. Li,et al."The dislocation structure evolution of deformation band and crack formation in a copper bicrystal with a perpendicular grain boundary".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 372.1-2(2004):221-228. |
入库方式： OAI收割
来源：金属研究所
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