Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples
文献类型：期刊论文
| 作者 | G. Wang ; S. D. Wu ; C. Esling ; G. Y. Li ; L. Zuo ; Z. G. Wang |
| 刊名 | Advanced Engineering Materials
 |
| 出版日期 | 2003 |
| 卷号 | 5期号:8页码:593-597 |
| 关键词 | electron channeling contrast enhanced grain-growth al-mg alloy angular extrusion deformation copper size |
| ISSN号 | 1438-1656 |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36043]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | G. Wang,S. D. Wu,C. Esling,et al. Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples[J]. Advanced Engineering Materials,2003,5(8):593-597. |
| APA | G. Wang,S. D. Wu,C. Esling,G. Y. Li,L. Zuo,&Z. G. Wang.(2003).Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples.Advanced Engineering Materials,5(8),593-597. |
| MLA | G. Wang,et al."Microstructural characteristics by EBSD and ECC in ECAE processed pure Cu samples".Advanced Engineering Materials 5.8(2003):593-597. |
入库方式： OAI收割
来源：金属研究所
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