Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples
文献类型：期刊论文
| 作者 | G. Wang ; S. D. Wu ; L. Zuo ; C. Esling ; Z. G. Wang ; G. Y. Li |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2003 |
| 卷号 | 346期号:1-2页码:83-90 |
| 关键词 | microstructure texture grain boundaries grain growth ECAE Cu electron channeling contrast al-mg alloy nanocrystalline materials plastic-deformation thermal-stability angular extrusion copper growth metals diffraction |
| ISSN号 | 0921-5093 |
| 中文摘要 | By means of equal channel angular extrusion (ECAE), pure Cu single crystal samples were processed down to the submicron scale. In some parts of the samples, recrystallization occurs at room temperature. The recrystallization mechanism was analyzed by SEM-EBSP and SEM-ECC techniques. The grain boundary character distribution (GBCD) and orientation distribution function (ODF) of the regions undergoing recrystallization were computed. The results show that the nuclei can be formed at the intersections of two different shear bands, and the microstructures and the grain boundary characters in these locations contribute to growth of recrystallized nuclei. The recrystallized grains had grown according to the Feltham's mechanism. (C) 2002 Elsevier Science B.V. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36044]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | G. Wang,S. D. Wu,L. Zuo,et al. Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2003,346(1-2):83-90. |
| APA | G. Wang,S. D. Wu,L. Zuo,C. Esling,Z. G. Wang,&G. Y. Li.(2003).Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,346(1-2),83-90. |
| MLA | G. Wang,et al."Microstructure, texture, grain boundaries in recrystallization regions in pure Cu ECAE samples".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 346.1-2(2003):83-90. |
入库方式： OAI收割
来源：金属研究所
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