Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films
文献类型：期刊论文
| 作者 | G. P. Zhang ; R. Schwaiger ; C. A. Volkert ; O. Kraft |
| 刊名 | Philosophical Magazine Letters
 |
| 出版日期 | 2003 |
| 卷号 | 83期号:8页码:477-483 |
| 关键词 | cycle fatigue copper-films deformation behavior |
| ISSN号 | 0950-0839 |
| 中文摘要 | This letter presents systematic experimental observations of fatigue damage and corresponding dislocation structures in thin Cu films as a function of film thickness made using transmission electron microscopy and focused-ion-beam microscopy. It is found that, in thick films and grains of at least 3.0 mum diameter, coarse surface extrusions and dislocation wall and cell structures occur whereas, in thin films or in small-diameter grains, finer extrusions occur but no clearly defined dislocation structures are present. This minimum required dimension of 3.0 mum for fatigue damage formation may be caused by constrained dislocation motion in small dimensions. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36153]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | G. P. Zhang,R. Schwaiger,C. A. Volkert,et al. Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films[J]. Philosophical Magazine Letters,2003,83(8):477-483. |
| APA | G. P. Zhang,R. Schwaiger,C. A. Volkert,&O. Kraft.(2003).Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films.Philosophical Magazine Letters,83(8),477-483. |
| MLA | G. P. Zhang,et al."Effect of film thickness and grain size on fatigue-induced dislocation structures in Cu thin films".Philosophical Magazine Letters 83.8(2003):477-483. |
入库方式： OAI收割
来源：金属研究所
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