Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals
文献类型：期刊论文
| 作者 | W. P. Jia ; Z. Y. Zhu ; Z. G. Wang ; S. X. Li |
| 刊名 | Journal of Materials Science & Technology
 |
| 出版日期 | 2002 |
| 卷号 | 18期号:2页码:108-112 |
| 关键词 | grain boundary triple junction cracking copper tricrystal tetracrystal stress-strain curves cyclic deformation polycrystalline copper bicrystals metals |
| ISSN号 | 1005-0302 |
| 中文摘要 | Cyclic symmetrical tension-compression fatigue tests in an axial plastic strain range of 2.0X10(-4) to 1.5X10(-3) were performed on three copper tetracrystal specimens containing two grain boundary triple lines as well as one copper tricrystal specimen employing a multiple step method. Experimental results show that the strengthening effect of triple junction (TJ) on axial saturation stress increased with increasing plastic strain amplitude. The strengthening effects owe much to the strain incompatibilities at TJ. The cyclic stress-strain (CSS) curves of tetracrystals are higher than that of tricrystal. At low strain amplitude, deformation at TJ is smaller than that near grain boundary (GB), which results in that the width of TJ effect zone is smaller than that near GB. Whether GB split or not is associated with the angle between GB and loading axis, activation of slip systems beside GB and the accommodation and annihilation of residual dislocations on GB planes. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36298]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | W. P. Jia,Z. Y. Zhu,Z. G. Wang,et al. Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals[J]. Journal of Materials Science & Technology,2002,18(2):108-112. |
| APA | W. P. Jia,Z. Y. Zhu,Z. G. Wang,&S. X. Li.(2002).Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals.Journal of Materials Science & Technology,18(2),108-112. |
| MLA | W. P. Jia,et al."Grain boundary triple junction effects on the fatigue deformation and cracking Behaviors of copper tricrystal and tetracrystals".Journal of Materials Science & Technology 18.2(2002):108-112. |
入库方式： OAI收割
来源：金属研究所
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