Microstrain effect on thermal properties of nanocrystalline CU
文献类型：期刊论文
| 作者 | L. H. Qian ; S. C. Wang ; Y. H. Zhao ; K. Lu |
| 刊名 | Acta Materialia
 |
| 出版日期 | 2002 |
| 卷号 | 50期号:13页码:3425-3434 |
| 关键词 | magnetron sputtering X-ray diffraction (XRD) nanocrystalline copper thermal properties x-ray-diffraction gas evaporation technique grain-growth particles palladium copper microstructure temperature boundaries expansion |
| ISSN号 | 1359-6454 |
| 中文摘要 | The nanocrystalline (nc) Cu samples with different microstrains but the same grain size were obtained by annealing a magnetron-sputtered ne Cu specimen. Quantitative X-ray diffraction (XRD) measurements show that with an increment of the microstrain from 0.14 to 0.24% the thermal expansion coefficient (TEC) of crystalline lattice increases by about 12%, the static displacement of atom from the equilibrium position (B-S) increases from 0.47 +/- 0.09 to 1.16 +/- 0.15 Angstrom(2), and Debye characteristic temperature (Theta(D)) decreases from 307.1 +/- 3.1 to 279.2 +/- 2.8 K. The microstrain effect on thermal properties in the nc Cu might be attributed to the change in density of grain boundary defects/dislocations. The present investigation demonstrates that the thermal properties of ne materials are determined by not only the grain size but also the microstructure of grain boundaries. (C) 2002 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36391]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. H. Qian,S. C. Wang,Y. H. Zhao,et al. Microstrain effect on thermal properties of nanocrystalline CU[J]. Acta Materialia,2002,50(13):3425-3434. |
| APA | L. H. Qian,S. C. Wang,Y. H. Zhao,&K. Lu.(2002).Microstrain effect on thermal properties of nanocrystalline CU.Acta Materialia,50(13),3425-3434. |
| MLA | L. H. Qian,et al."Microstrain effect on thermal properties of nanocrystalline CU".Acta Materialia 50.13(2002):3425-3434. |
入库方式： OAI收割
来源：金属研究所
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