Creep behavior of cold-rolled nanocrystalline pure copper
文献类型：期刊论文
| 作者 | B. Cai ; Q. P. Kong ; P. Cui ; L. Lu ; K. Lu |
| 刊名 | Scripta Materialia
 |
| 出版日期 | 2001 |
| 卷号 | 45期号:12页码:1407-1413 |
| 关键词 | creep nanocrystalline copper cold rolling grain boundary diffusional creep temperature creep grain-boundaries room-temperature superplasticity deformation |
| ISSN号 | 1359-6462 |
| 中文摘要 | The creep of cold rolled nanocrystalline Cu has been investigated at 20-50 degreesC. The most reasonable stress exponent is found to be 2, the corresponding activation energy is 0.82 eV. The results imply that the creep is possibly associated with grain boundary sliding. The increase of threshold stress after rolling is associated with the increase of microstrain. (C) 2001 Acta Materialia Inc. Published by Elsevier Science Ltd. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/36600]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | B. Cai,Q. P. Kong,P. Cui,et al. Creep behavior of cold-rolled nanocrystalline pure copper[J]. Scripta Materialia,2001,45(12):1407-1413. |
| APA | B. Cai,Q. P. Kong,P. Cui,L. Lu,&K. Lu.(2001).Creep behavior of cold-rolled nanocrystalline pure copper.Scripta Materialia,45(12),1407-1413. |
| MLA | B. Cai,et al."Creep behavior of cold-rolled nanocrystalline pure copper".Scripta Materialia 45.12(2001):1407-1413. |
入库方式： OAI收割
来源：金属研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。