Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples
文献类型：期刊论文
| 作者 | L. Lu ; L. B. Wang ; B. Z. Ding ; K. Lu |
| 刊名 | Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing
 |
| 出版日期 | 2000 |
| 卷号 | 286期号:1页码:125-129 |
| 关键词 | nanocrystalline Cu grain growth strain release microstrain grain-growth metals alloys |
| ISSN号 | 0921-5093 |
| 中文摘要 | The objective of this work is to investigate the microstrain effect on grain growth and strain release processes in nanocrystalline (nc) samples. Two kinds of nc Cu samples were studied by using differential scanning calorimetry (DSC), X-ray diffraction (XRD) and transmission electron microscopy (TEM): an electro-deposited nc Cu sample with an average grain size of about 30 nm and one after cold-rolling in which the average grain size remain unchanged but the microstrain is substantially elevated. Measurement results indicated for the electro-deposited nc Cu, grain growth occurs at about 70 degrees C, which was prior to the major strain release process (onset at 150 degrees C). While for the as-rolled nc Cu, the grain growth onset temperature increases up to about 150 degrees C and that of the strain release process drops to about 115 degrees C. These results showed an evident correlation between the grain size stability and the microstrain in the nc materials. (C) 2000 Elsevier Science S.A. All rights reserved. |
| 原文出处 | |
| 公开日期 | 2012-04-14 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/37119]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. Lu,L. B. Wang,B. Z. Ding,et al. Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples[J]. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,2000,286(1):125-129. |
| APA | L. Lu,L. B. Wang,B. Z. Ding,&K. Lu.(2000).Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples.Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing,286(1),125-129. |
| MLA | L. Lu,et al."Comparison of the thermal stability between electro-deposited and cold-rolled nanocrystalline copper samples".Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing 286.1(2000):125-129. |
入库方式： OAI收割
来源：金属研究所
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