New technology for fabricating a thin film/thick BOX silicon-on-insulator
文献类型：期刊论文
| 作者 | Wei, Xing (State Key Laboratory of Functional Material for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Acad. Of Sci.) ; Wang, Xiang ; Chen, Meng ; Chen, Jing ; Zhang, Miao ; Wang XI ; Lin, Chenglu |
| 刊名 | Source:Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, v 29, n 7, July, 2008, p 1350-1353
 |
| 出版日期 | 2008 |
| 卷号 | 29期号:7页码:1350-1353 |
| ISSN号 | 02534177 |
| 收录类别 | EI |
| 公开日期 | 2012-05-31 |
| 源URL | [http://ir.sim.ac.cn/handle/331004/109058]  |
| 专题 | 上海微系统与信息技术研究所_功能材料与器件_期刊论文 |
| 推荐引用方式 GB/T 7714 | Wei, Xing ,Wang, Xiang,Chen, Meng,et al. New technology for fabricating a thin film/thick BOX silicon-on-insulator[J]. Source:Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, v 29, n 7, July, 2008, p 1350-1353,2008,29(7):1350-1353. |
| APA | Wei, Xing .,Wang, Xiang.,Chen, Meng.,Chen, Jing.,Zhang, Miao.,...&Lin, Chenglu.(2008).New technology for fabricating a thin film/thick BOX silicon-on-insulator.Source:Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, v 29, n 7, July, 2008, p 1350-1353,29(7),1350-1353. |
| MLA | Wei, Xing ,et al."New technology for fabricating a thin film/thick BOX silicon-on-insulator".Source:Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, v 29, n 7, July, 2008, p 1350-1353 29.7(2008):1350-1353. |
入库方式： OAI收割
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