Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour
文献类型：期刊论文
| 作者 | Zhou F(周峰) ; Sun JY(孙嘉奕); Hu M(胡明); Liu WM(刘维民); Gao XM(高晓明); Weng LJ(翁立军)
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| 刊名 | Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology
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| 出版日期 | 2011 |
| 卷号 | 225页码:1121-1129 |
| 关键词 | low temperature structure wear behaviour Cu films |
| ISSN号 | 1350-6501 |
| 通讯作者 | 刘维民 |
| 中文摘要 | Cu films were prepared by arc ion plating (AIP) at low temperature (Ts) and investigated by X-ray diffraction, field emission scanning electron microscope atomic force microscopy, transmission electron microscope, etc. It is found that low Ts ( 221 K) can refine the crystallite size of the Cu films and leads to compact and smooth surface structure. Further decreasing Ts to 135 K makes the inter-grain gaps turn bigger. The wear behaviours of the Cu films in vacuum were characterized using a ball-on-disk tribometer. The results show that the Cu films deposited at the Ts range of 135–221 K have better wear resistance, and the wear rates are two to three orders lower than that of the film deposited at room temperature. The compact and dense arrangement of nanoscale crystallites significantly contributes to the improved film–substrate adhesion and so the excellent antiwear behaviour. |
| 学科主题 | 材料科学与物理化学 |
| 收录类别 | SCI |
| 资助信息 | the National Natural Science Foundation of China [Grant no. 50301015];the 973 Project [no. 2007CB607601] of China |
| 语种 | 英语 |
| WOS记录号 | WOS:000296207600006 |
| 公开日期 | 2012-09-24 |
| 源URL | [http://210.77.64.217/handle/362003/744]  |
| 专题 | 兰州化学物理研究所_固体润滑国家重点实验室 兰州化学物理研究所_先进润滑与防护材料研究发展中心 |
| 通讯作者 | Liu WM(刘维民) |
| 推荐引用方式 GB/T 7714 | Zhou F,Sun JY,Hu M,et al. Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour[J]. Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,2011,225:1121-1129. |
| APA | 周峰,孙嘉奕,胡明,刘维民,高晓明,&翁立军.(2011).Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour.Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology,225,1121-1129. |
| MLA | 周峰,et al."Copper films deposited by arc ion plating at low temperatures exhibiting excellent antiwear behaviour".Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology 225(2011):1121-1129. |
入库方式： OAI收割
来源：兰州化学物理研究所
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