Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film
文献类型：期刊论文
| 作者 | Liu Bo1; Yang Jijun1; Jiao Guohua2; Hu Kewei3 |
| 刊名 | plasma science & technology
 |
| 出版日期 | 2012-07-01 |
| 卷号 | 14期号:7页码:619-623 |
| 关键词 | interfacial adhesion thermal stability self-aligned CuSiN process diffusion barrier |
| ISSN号 | 1009-0630 |
| 产权排序 | 2 |
| 合作状况 | 国内 |
| 英文摘要 | a highly reliable interface of self-aligned barrier cusin thin layer between the cu film and the nano-porous sic:h (p-sic:h) capping barrier (k=3.3) has been developed in the present work. with the introduction of self-aligned barrier (sab) cusin between a cu film and a p-sic:h capping barrier, the interfacial thermal stability and the adhesion of the cu/p-sic:h film are considerably enhanced. a significant improvement of adhesion strength and thermal stability of cu/p-sic:h/sioc:h film stack has been achieved by optimizing the pre-clean step before cap-layer deposition and by forming the cusin-like phase. this cap layer on the surface of the cu can provide a more cohesive interface and effectively suppress cu atom migration as well. |
| WOS标题词 | science & technology ; physical sciences |
| 类目[WOS] | physics, fluids & plasmas |
| 研究领域[WOS] | physics |
| 关键词[WOS] | nano-scratch technique ; nm technology node ; carbon-films ; interconnects ; resistance ; diffusion ; barriers |
| 收录类别 | SCI ; EI |
| 语种 | 英语 |
| WOS记录号 | WOS:000307123300012 |
| 公开日期 | 2012-12-04 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/20419]  |
| 专题 | 西安光学精密机械研究所_瞬态光学技术国家重点实验室 |
| 作者单位 | 1.Sichuan Univ, Inst Nucl Sci & Technol, Minist Educ, Key Lab Radiat Phys & Technol, Chengdu 610064, Peoples R China 2.Chinese Acad Sci, Xian Inst Opt & Precis Mech, State key Lab Transient Opt & Photon, Xian 710049, Peoples R China 3.Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China |
| 推荐引用方式 GB/T 7714 | Liu Bo,Yang Jijun,Jiao Guohua,et al. Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film[J]. plasma science & technology,2012,14(7):619-623. |
| APA | Liu Bo,Yang Jijun,Jiao Guohua,&Hu Kewei.(2012).Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film.plasma science & technology,14(7),619-623. |
| MLA | Liu Bo,et al."Improvement of Interfacial Adhesion Strength and Thermal Stability of Cu/p-SiC:H/SiOC:H Film Stack by Plasma Treatment on the Surface of Cu Film".plasma science & technology 14.7(2012):619-623. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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