Analysis of Heat Dissipation in LED with Various Adhesives
文献类型：期刊论文
| 作者 | Zi-Gui Huang* ; Zheng-Yu Chen** |
| 刊名 | JOURNAL OF THERMAL SCIENCE
 |
| 出版日期 | 2011 |
| 卷号 | 20期号:3页码:254,259 |
| 关键词 | LED heat dissipation finite element method heat transfer coefficient adhesive |
| 公开日期 | 2012-12-20 |
| 源URL | [http://ir.etp.ac.cn/handle/311046/51498]  |
| 专题 | 工程热物理研究所_Journal of Thermal Science_期刊论文 |
| 推荐引用方式 GB/T 7714 | Zi-Gui Huang*,Zheng-Yu Chen**. Analysis of Heat Dissipation in LED with Various Adhesives[J]. JOURNAL OF THERMAL SCIENCE,2011,20(3):254,259. |
| APA | Zi-Gui Huang*,&Zheng-Yu Chen**.(2011).Analysis of Heat Dissipation in LED with Various Adhesives.JOURNAL OF THERMAL SCIENCE,20(3),254,259. |
| MLA | Zi-Gui Huang*,et al."Analysis of Heat Dissipation in LED with Various Adhesives".JOURNAL OF THERMAL SCIENCE 20.3(2011):254,259. |
入库方式： OAI收割
来源：工程热物理研究所
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