A method of assembling vcsel chips on a sub mount
文献类型：专利
| 作者 | PRUIJMBOOM ARMAND; DUMOULIN RAIMOND LOUIS; MILLER MICHAEL |
| 发表日期 | 2019-10-24 |
| 专利号 | IN323584B |
| 著作权人 | KONINKLIJKE PHILIPS N.V. |
| 国家 | 印度 |
| 文献子类 | 授权发明 |
| 其他题名 | A method of assembling vcsel chips on a sub mount |
| 英文摘要 | The present invention relates to a method of assembling VCSEL chips (1) on a sub mount (2). A de wetting layer (13) is deposited on a connecting side of the VCSEL chips (1) which is to be connected to the sub mount (2). A further de wetting layer (13) is deposited on a connecting side of the sub mount (2) which is to be connected to the VCSEL chips (1). The de wetting layers (13) are deposited with a patterned design or are patterned after depositing to define connecting areas (21) on the sub mount (2) and the VCSEL chips (1). A solder (15) is applied to the connecting areas (21) of at least one of the two connecting sides. The VCSEL chips (1) are placed on the sub mount (2) and soldered to the sub mount (2) to electrically and mechanically connect the VCSEL chips (1) and the sub mount (2). With the proposed method a high alignment accuracy of the VCSEL chips (1) on the sub mount (2) is achieved without time consuming measures. |
| 公开日期 | 2019-10-24 |
| 申请日期 | 2014-03-26 |
| 状态 | 未确认 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32165]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | KONINKLIJKE PHILIPS N.V. |
| 推荐引用方式 GB/T 7714 | PRUIJMBOOM ARMAND,DUMOULIN RAIMOND LOUIS,MILLER MICHAEL. A method of assembling vcsel chips on a sub mount. IN323584B. 2019-10-24. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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