Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die
文献类型：专利
| 作者 | TSENG, CHUN-HAO; KUO, YING-HAO; YEE, KUO-CHUNG |
| 发表日期 | 2018-11-20 |
| 专利号 | US10135224 |
| 著作权人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die |
| 英文摘要 | An apparatus and method of forming a chip package with a waveguide for light coupling is disclosed. The method includes depositing an adhesive layer over a carrier. The method further includes depositing a laser diode (LD) die having a laser emitting area onto the adhesive layer and depositing a molding compound layer over the LD die and the adhesive layer. The method still further includes curing the molding compound layer and partially removing the molding compound layer to expose the laser emitting area. The method also includes depositing a ridge waveguide structure adjacent to the laser emitting area and depositing an upper cladding layer over the ridge waveguide structure. |
| 公开日期 | 2018-11-20 |
| 申请日期 | 2017-11-27 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32362]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 推荐引用方式 GB/T 7714 | TSENG, CHUN-HAO,KUO, YING-HAO,YEE, KUO-CHUNG. Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die. US10135224. 2018-11-20. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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