Chip on carrier
文献类型：专利
| 作者 | MU, JIANWEI; DING, FRANK LEI; WU, TAO; DENG, HONGYU; AMIRKIAI, MAZIAR |
| 发表日期 | 2019-08-06 |
| 专利号 | US10374386 |
| 著作权人 | FINISAR CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Chip on carrier |
| 英文摘要 | A chip may include a first substantially planar isolation layer with a first surface and a second surface opposite the first surface. The chip may include a first substantially planar conduction layer with a first surface positioned adjacent to the second surface of the first isolation layer and a second surface opposite the first surface. The chip may include a second substantially planar isolation layer with a first surface positioned adjacent to the second surface of the first conduction layer and a second surface opposite the first surface. The chip may include a second conduction layer etched on the second surface of the second isolation layer. The second conduction layer may include an anode trace, a cathode trace, and an optical transmitter positioned on the cathode trace. The chip may include one or more vias through the second isolation layer electrically coupling the anode trace with the first conduction layer. |
| 公开日期 | 2019-08-06 |
| 申请日期 | 2018-06-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32375]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FINISAR CORPORATION |
| 推荐引用方式 GB/T 7714 | MU, JIANWEI,DING, FRANK LEI,WU, TAO,et al. Chip on carrier. US10374386. 2019-08-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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