Method of manufacturing an electronic device
文献类型：专利
| 作者 | TAKAYAMA, SEIICHI; ITO, YASUHIRO; MORI, NOBUYUKI; SHIMAZAWA, KOJI; TAKANUKI, KAZUAKI; ANDO, YOUICHI |
| 发表日期 | 2017-05-23 |
| 专利号 | US9659582 |
| 著作权人 | TDK CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of manufacturing an electronic device |
| 英文摘要 | A method of manufacturing an electronic device includes a positioning step of positioning a first member supporting a laser diode with respect to a second member having a waveguide, a bonding step of bonding the first member and the second member together, and a checking step of checking the accuracy of positioning of the first member with respect to the second member. In the positioning step, the laser diode is energized to allow laser light to be emitted, and the laser light is allowed to be incident on the incidence end of the waveguide. In the bonding step, a bonding material is melted by irradiating the first member with heating light while the laser diode is not energized. In the checking step, the laser diode is energized again. |
| 公开日期 | 2017-05-23 |
| 申请日期 | 2013-01-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/32994]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | TDK CORPORATION |
| 推荐引用方式 GB/T 7714 | TAKAYAMA, SEIICHI,ITO, YASUHIRO,MORI, NOBUYUKI,et al. Method of manufacturing an electronic device. US9659582. 2017-05-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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