System for soldering a semiconductor laser to a metal base
文献类型：专利
| 作者 | DUDA, EUGENE; MAUMY, ALAIN; TONDU, CLAUDE |
| 发表日期 | 1982-03-23 |
| 专利号 | US4321617 |
| 著作权人 | THOMSON-CSF |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | System for soldering a semiconductor laser to a metal base |
| 英文摘要 | A GaAs diode and a copper base are joined together so as to form a soldered system comprising an indium layer inserted between two tungsten layers which serve as a barrier for preventing indium diffusion. A thin gold or platinum wetting layer is applied to the tungsten layers to aid in adherence of the solder to the tungsten without the impairment of the indium during soldering operations due to alloying. The invention is applicable to optical-fiber telecommunication systems. |
| 公开日期 | 1982-03-23 |
| 申请日期 | 1979-07-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33216]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | THOMSON-CSF |
| 推荐引用方式 GB/T 7714 | DUDA, EUGENE,MAUMY, ALAIN,TONDU, CLAUDE. System for soldering a semiconductor laser to a metal base. US4321617. 1982-03-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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