光集積回路及び集積回路用パッケージ
文献类型：专利
| 作者 | 松田 修; 前田 浩一; 日比 直文; 谷口 正 |
| 发表日期 | 1999-04-09 |
| 专利号 | JP2910113B2 |
| 著作权人 | ソニー株式会社 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | 光集積回路及び集積回路用パッケージ |
| 英文摘要 | PURPOSE:To easily package an optical integrated circuit into small-sized constitution with high accuracy by chucking the upper-step part of a prism and to evade damage to a prism principal part or semiconductor substrate by providing step parts on both sides of the prism. CONSTITUTION:The mutually parallel step parts 56 are formed on both sides of the prism 15 arranged on photodetectors 13 and 14. The section of the prism 15, i.e. prism section intersecting the line connecting a semiconductor laser 16 and the photodetectors 13 and 14 at right angles is in a projection shape. Consequently, the projecting upper-step part of the prism 15 is chucked to package the optical integrated circuit to small size and a chuck means contacts none of the principal part of the prism 15, photodetectors 13 and 14, and semiconductor substrate 12 where other circuit elements are formed and the damage can be evaded. |
| 公开日期 | 1999-06-23 |
| 申请日期 | 1990-01-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33347]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ソニー株式会社 |
| 推荐引用方式 GB/T 7714 | 松田 修,前田 浩一,日比 直文,等. 光集積回路及び集積回路用パッケージ. JP2910113B2. 1999-04-09. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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