Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces
文献类型：专利
| 作者 | VAN DE PAS, HERMANUS A.; TIJBURG, RUDOLF P.; DE POORTER, JOHANNES A. |
| 发表日期 | 1995-11-21 |
| 专利号 | US5468683 |
| 著作权人 | U.S. PHILIPS CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces |
| 英文摘要 | Optoelectronic devices often comprise an optoelectronic semiconductor element such as a diode laser fastened on a carrier. The desired path of a beam of radiation from or to such an element often implies that such an element has to be fastened on the carrier at a certain, for example right angle. As a result, a contact surface of such an element also encloses an angle with another contact surface which lies on the carrier. In a method according to the invention, one of the two contact surfaces is provided with a wire which has a free end, and after fastening of the diode laser or photodiode the free end of the wire is fastened on the other contact surface. One wire connection can suffice and no auxiliary block is necessary with this wire connection method in two steps. Preferably, the wire having the free end is provided on the element. This has various additional advantages such as a less critical fastening of the free end of the wire and the possibility of a reliable intermediate test owing to which the yield of the expensive end product is increased. |
| 公开日期 | 1995-11-21 |
| 申请日期 | 1993-09-22 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33452]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | U.S. PHILIPS CORPORATION |
| 推荐引用方式 GB/T 7714 | VAN DE PAS, HERMANUS A.,TIJBURG, RUDOLF P.,DE POORTER, JOHANNES A.. Method of manufacturing an optoelectronic semiconductor device having a single wire between non-parallel surfaces. US5468683. 1995-11-21. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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