Semiconductor laser package and fabrication method thereof
文献类型：专利
| 作者 | ISHIGURO, TAKAHIDE; HAMAOKA, OSAMU |
| 发表日期 | 2004-11-02 |
| 专利号 | US6812501 |
| 著作权人 | SHARP KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser package and fabrication method thereof |
| 英文摘要 | A semiconductor laser package includes an island member formed of metal, including a base plane and a block member protruding in a direction substantially perpendicular to the base plane, a lead, a resin member molded integrally with the island member and the lead so as to fix the relative position relationship between the island member and the lead, a laser chip fixed at the block member, and a light receiving element functioning as a light receiving unit, directly fixed to the resin member. |
| 公开日期 | 2004-11-02 |
| 申请日期 | 2002-01-28 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33771]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | ISHIGURO, TAKAHIDE,HAMAOKA, OSAMU. Semiconductor laser package and fabrication method thereof. US6812501. 2004-11-02. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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