Semiconductor laser device, method for manufacturing the same and optical pickup apparatus
文献类型：专利
| 作者 | HAMAOKA, OSAMU |
| 发表日期 | 2009-02-10 |
| 专利号 | US7489716 |
| 著作权人 | SHARP KABUSHIKI KAISHA |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Semiconductor laser device, method for manufacturing the same and optical pickup apparatus |
| 英文摘要 | A semiconductor laser chip is mounted on one surface of an electrode lead for chip mounting having a heat release region for releasing heat around the semiconductor laser chip. Therefore, it is possible to release heat of the semiconductor laser chip to the chip mounting lead and release the heat from the heat release region, thereby suppressing increase of a temperature of the semiconductor laser chip and suppressing shortening of life of the semiconductor laser chip. |
| 公开日期 | 2009-02-10 |
| 申请日期 | 2007-01-19 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/33982]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | SHARP KABUSHIKI KAISHA |
| 推荐引用方式 GB/T 7714 | HAMAOKA, OSAMU. Semiconductor laser device, method for manufacturing the same and optical pickup apparatus. US7489716. 2009-02-10. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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