Optical device package and optical semiconductor device using the same
文献类型：专利
| 作者 | FUJINO, JUNJI; TANAKA, HIDEYUKI; MORI, KENZO |
| 发表日期 | 2011-01-25 |
| 专利号 | US7875901 |
| 著作权人 | MITSUBISHI ELECTRIC CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical device package and optical semiconductor device using the same |
| 英文摘要 | An optical device package comprises: a metal frame including a substrate and a rectangular die pad portion integrally connected to the substrate, wherein the substrate is a metal plate, and the die pad portion is bent from the substrate such that the die pad portion extends from the substrate at an angle of 90 degrees; signal lead pins extend in the opposite directions from the die pad portion relative to the substrate such that the first lead pins intersect the principal surfaces of the substrate at a right angle and are spaced apart from the metal frame; and a molded resin member including a plate-like resin base extending across and in contact with one of the principal surfaces of the substrate, wherein the signal lead pins protrude from a surface of the resin base; surfaces of the signal lead pins are covered with the molded resin member; and the metal frame and the signal lead pins are secured in place by the molded resin member. |
| 公开日期 | 2011-01-25 |
| 申请日期 | 2009-10-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34045]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | MITSUBISHI ELECTRIC CORPORATION |
| 推荐引用方式 GB/T 7714 | FUJINO, JUNJI,TANAKA, HIDEYUKI,MORI, KENZO. Optical device package and optical semiconductor device using the same. US7875901. 2011-01-25. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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