Joining method and device produced by this method and joining unit
文献类型：专利
| 作者 | SUGA, TADATOMO; OKADA, MASUAKI |
| 发表日期 | 2014-02-18 |
| 专利号 | US8651363 |
| 著作权人 | BONDTECH INC. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Joining method and device produced by this method and joining unit |
| 英文摘要 | A practical bonding technique is provided for solid-phase room-temperature bonding not requiring a profile irregularity of the order of several nanometers, in which a high-vacuum energy wave treatment and continuous high-vacuum bonding are not required. Since an adhering substance layer is thin immediately after a surface activating treatment using an energy wave, a bonding interface is spread by crushing the adhering substance layer to perform bonding, so that a new surface appears on a bonding surface, and objects to be bonded are bonded together. In order to crush the adhering substance layer more easily, a bonding metal of a bonding portion of the object to be bonded requires a low hardness. According to the results of various experiments conducted by the present inventors, it was found that the hardness of the bonding portion which is a Vickers hardness of 200 Hv or less is particularly effective for room-temperature bonding. |
| 公开日期 | 2014-02-18 |
| 申请日期 | 2011-11-16 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34098]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | BONDTECH INC. |
| 推荐引用方式 GB/T 7714 | SUGA, TADATOMO,OKADA, MASUAKI. Joining method and device produced by this method and joining unit. US8651363. 2014-02-18. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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