Method of mounting semiconductor element, and semiconductor device
文献类型：专利
| 作者 | KUBOTA, TAKASHI; KITAJIMA, MASAYUKI; YAMAKAMI, TAKATOYO; KIRA, HIDEHIKO |
| 发表日期 | 2017-04-04 |
| 专利号 | US9615464 |
| 著作权人 | FUJITSU LIMITED |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Method of mounting semiconductor element, and semiconductor device |
| 英文摘要 | A method of mounting a semiconductor element, the method includes: attaching a first solder joint material onto a first pad formed on a substrate supplying a second solder joint material onto the first solder joint material, a second melting point of the second solder joint material being lower than a first melting point of the first solder joint material; arranging the semiconductor element so that a second pad formed on the semiconductor element faces the first pad and a joint gap is provided between the semiconductor element and the substrate; and performing reflow at a reflow temperature lower than the first melting point and higher than the second melting point to join the first solder joint material and the second solder joint material. |
| 公开日期 | 2017-04-04 |
| 申请日期 | 2013-11-07 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34188]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FUJITSU LIMITED |
| 推荐引用方式 GB/T 7714 | KUBOTA, TAKASHI,KITAJIMA, MASAYUKI,YAMAKAMI, TAKATOYO,et al. Method of mounting semiconductor element, and semiconductor device. US9615464. 2017-04-04. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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