Optical device wafer processing method
文献类型：专利
| 作者 | OBA, RYUGO; SHOTOKUJI, TAKUMI; KIRIHARA, NAOTOSHI |
| 发表日期 | 2018-10-23 |
| 专利号 | US10109527 |
| 著作权人 | DISCO CORPORATION |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Optical device wafer processing method |
| 英文摘要 | An optical device wafer processing method includes a shield tunnel forming step of applying a pulsed laser beam having a transmission wavelength to a sapphire substrate along an area corresponding to each division line from the back side of the sapphire substrate in the condition where the focal point of the pulsed laser beam is set inside the sapphire substrate, thereby forming a plurality of shield tunnels arranged along the area corresponding to each division line, each shield tunnel being composed of a fine hole and an amorphous region formed around the fine hole for shielding the fine hole. The optical device wafer processing method further includes a dividing step of applying an external force to the optical device wafer after performing a light emitting layer forming step, thereby dividing the optical device wafer along the division lines to obtain the individual optical device chips. |
| 公开日期 | 2018-10-23 |
| 申请日期 | 2016-09-30 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34323]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | DISCO CORPORATION |
| 推荐引用方式 GB/T 7714 | OBA, RYUGO,SHOTOKUJI, TAKUMI,KIRIHARA, NAOTOSHI. Optical device wafer processing method. US10109527. 2018-10-23. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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