Laser module package with dual colors and multi-dies
文献类型：专利
| 作者 | HWANG, JUNG-MIN; LIN, YU-CHUN; HSIEH, CHIA-HUNG; WU, MING-CHO |
| 发表日期 | 2019-02-26 |
| 专利号 | US10218151 |
| 著作权人 | ARIMA LASERS CORP. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Laser module package with dual colors and multi-dies |
| 英文摘要 | A laser module package with dual colors and multi-dies mainly includes a first PCB arranged in long shape and electrically connected to a plurality of first dies, a second PCB arranged in long shape and electrically connected to a plurality of second dies, a plurality of first collimators correspondingly disposed in a plurality of first openings, and a plurality of second collimators correspondingly disposed in a plurality of second openings. A plurality of first reflectors correspondingly reflects laser beams emitted from the first dies to the first collimators and a plurality of second reflectors correspondingly reflects laser beams emitted from the second dies to the second collimators; or having a plurality of first metal pieces fixing corresponding first dies for the laser beams emitted therefrom to go through the corresponding first collimators and a plurality of second metal pieces fixing corresponding second dies for the laser beams emitted therefrom to go through the corresponding second collimators. |
| 公开日期 | 2019-02-26 |
| 申请日期 | 2018-05-25 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34385]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | ARIMA LASERS CORP. |
| 推荐引用方式 GB/T 7714 | HWANG, JUNG-MIN,LIN, YU-CHUN,HSIEH, CHIA-HUNG,et al. Laser module package with dual colors and multi-dies. US10218151. 2019-02-26. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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