Testing method of surface-emitting laser device and testing device thereof
文献类型：专利
| 作者 | HIRAIWA, KOJI; KAGEYAMA, TAKEO; IWAI, NORIHIRO; TAKAKI, KEISHI |
| 发表日期 | 2012-05-15 |
| 专利号 | US8178364 |
| 著作权人 | FURUKAWA ELECTRIC CO., LTD. |
| 国家 | 美国 |
| 文献子类 | 授权发明 |
| 其他题名 | Testing method of surface-emitting laser device and testing device thereof |
| 英文摘要 | A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane with a pitch same as that of the surface-emitting laser devices being electrically connected to each other to have contact with pad electrodes of the surface-emitting laser devices, respectively, and applying a current to second electrodes of the surface-emitting laser devices and the contact electrodes. The wafer level burn-in test is performed while heating the wafer at a predetermined temperature. Laser lights emitted from the surface-emitting laser devices are monitored during the wafer level burn-in test. |
| 公开日期 | 2012-05-15 |
| 申请日期 | 2010-06-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34521]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | FURUKAWA ELECTRIC CO., LTD. |
| 推荐引用方式 GB/T 7714 | HIRAIWA, KOJI,KAGEYAMA, TAKEO,IWAI, NORIHIRO,et al. Testing method of surface-emitting laser device and testing device thereof. US8178364. 2012-05-15. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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