Method and apparatus for determining acceptance/rejection of fine diameter wire bonding
文献类型：专利
| 作者 | MATSUMOTO, JUN |
| 发表日期 | 2019-08-14 |
| 专利号 | EP2549268B1 |
| 著作权人 | JTEKT CORPORATION |
| 国家 | 欧洲专利局 |
| 文献子类 | 授权发明 |
| 其他题名 | Method and apparatus for determining acceptance/rejection of fine diameter wire bonding |
| 英文摘要 | Disclosed are a method and an appartus for determining acceptance/rejection of fine diameter wire bonding of semiconductor devices, LED devices, and the like at a high accuracy without contact, said acceptance/rejection having not been determined by conventional image inspecting methods and the like. The appartus is configured of a heating laser device (1) which spot-heats the bonding portion of the fine diameter wire; a two-wavelength infrared radiation thermometer (2), which corrects an emissivity and measures a temperature at a high speed on the basis of a minute amount of infrared rays radiated from the heated portion of the fine diameter wire; and a correcting/determining means (4), which corrects the measurement results obtained from the two-wavelenght infrared radiation thermometer (2) to a temperature change with reference heating power, then determines acceptance/rejection of the bonding by comparing the corrected temperature change or a value correlated to a bonding area obtained on the basis of the corrected temperature change with a temperature change indicated by an acceptable reference product having the temperature change corrected with the reference heating power or a value correlated to a bonding area obtained on the basis of the temperature change indicated bye the acceptable reference product. |
| 公开日期 | 2019-08-14 |
| 申请日期 | 2011-03-08 |
| 状态 | 授权 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34523]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | JTEKT CORPORATION |
| 推荐引用方式 GB/T 7714 | MATSUMOTO, JUN. Method and apparatus for determining acceptance/rejection of fine diameter wire bonding. EP2549268B1. 2019-08-14. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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