光結合装置
文献类型：专利
| 作者 | 仲川 栄一; 山下 純一郎; 鈴木 昭伸; 三宅 良雄; 竹居 敏夫 |
| 发表日期 | 1994-07-06 |
| 专利号 | JP1994052819B2 |
| 著作权人 | 三菱電機株式会社 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | 光結合装置 |
| 英文摘要 | PURPOSE:To improve coupling efficiency between an optical fiber and a semiconductor laser element by fixing a cover manufactured by a material having high rigidity to a section, where the optical fiber is in contact with solder, adjusting the axial alignment of the optical fiber and fastening the optical fiber to a chip carrier. CONSTITUTION:A semiconductor laser element 1 is fixed to a chip carrier 2, and a cover 10 having high rigidity is fixed to a section, where an optical fiber 3 and solder a4 are in contact, with solder b11 in structure in which the periphery of the optical fiber 3 is covered. Solder a4 is melted by a soldering iron 8, the cover 10 is held and the position of the optical fiber 3 is adjusted, the optical fiber is stopped at a position where outgoing beams 9 from the laser element 1 and the optical fiber 3 are coupled most excellently, and the soldering iron 8 is detached and solder a4 is cured. Solder a4 is dragged to the soldering iron 8 at that time, but the optical fiber 3 is not bent and deformed because the cover 10 consists of the quality of materials having high rigidity. Accordingly, solder a4 is cured as a position where the adjustment of axial alignment is completed is kept as it is, thus fastening the optical fiber 3 to the chip carrier. |
| 公开日期 | 1994-07-06 |
| 申请日期 | 1985-03-08 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34773]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 三菱電機株式会社 |
| 推荐引用方式 GB/T 7714 | 仲川 栄一,山下 純一郎,鈴木 昭伸,等. 光結合装置. JP1994052819B2. 1994-07-06. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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