半導体装置
文献类型：专利
| ; | |
| 作者 | 西口 勝規; 関口 剛 |
| 发表日期 | 1996-05-17 ; 1996-05-17 |
| 专利号 | JP2519698B2 ; JP2519698B2 |
| 著作权人 | 住友電気工業株式会社 ; 住友電気工業株式会社 |
| 国家 | 日本 ; 日本 |
| 文献子类 | 授权发明 ; 授权发明 |
| 其他题名 | 半導体装置 ; 半導体装置 |
| 英文摘要 | PURPOSE:To shorten a bonding wire and, at the same time, to enhance the cooling efficiency of a light-emitting device by a method wherein a spacer composed of a material with excellent thermal conductivity is installed between the light-emitting device and a substrate while a connecting terminal of the light-emitting device is situated at the same height as the connecting terminal for an integrated circuit for driving the light-emitting device. CONSTITUTION:A light-emitting diode 13 is mounted on an AlN ceramic substrate 11 via a diamond-made spacer 12, and an integrated circuit 14 for driving the light-emitting device is mounted directly on the substrate 1 The shape of this light-emitting device 13 is an almost rectangular parallelepiped, and the shape of the integrated circuit 14 for driving the light-emitting device is also an almost rectangular parallelepiped. As the spacer 12 which is used to mount the light-emitting device 13, a diamond chip is used. At this kind of circuit, it is possible to shorten the effective length of a bonding wire 15 which connects the light-emitting device 13 to the integrated circuit 14 for driving the light-emitting device.; PURPOSE:To shorten a bonding wire and, at the same time, to enhance the cooling efficiency of a light-emitting device by a method wherein a spacer composed of a material with excellent thermal conductivity is installed between the light-emitting device and a substrate while a connecting terminal of the light-emitting device is situated at the same height as the connecting terminal for an integrated circuit for driving the light-emitting device. CONSTITUTION:A light-emitting diode 13 is mounted on an AlN ceramic substrate 11 via a diamond-made spacer 12, and an integrated circuit 14 for driving the light-emitting device is mounted directly on the substrate 1 The shape of this light-emitting device 13 is an almost rectangular parallelepiped, and the shape of the integrated circuit 14 for driving the light-emitting device is also an almost rectangular parallelepiped. As the spacer 12 which is used to mount the light-emitting device 13, a diamond chip is used. At this kind of circuit, it is possible to shorten the effective length of a bonding wire 15 which connects the light-emitting device 13 to the integrated circuit 14 for driving the light-emitting device. |
| 公开日期 | 1996-07-31 ; 1996-07-31 |
| 申请日期 | 1986-12-05 ; 1986-12-05 |
| 状态 | 失效 ; 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34813]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 住友電気工業株式会社 |
| 推荐引用方式 GB/T 7714 | 西口 勝規,関口 剛. 半導体装置, 半導体装置. JP2519698B2, JP2519698B2. 1996-05-17, 1996-05-17. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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