発熱体の放熱構造
文献类型：专利
| 作者 | 藤野 裕代; 高橋 実; 金井 紀洋士; 橋本 秀之; 小沢 正之 |
| 发表日期 | 1996-03-29 |
| 专利号 | JP1996034273B2 |
| 著作权人 | 株式会社日立製作所 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | 発熱体の放熱構造 |
| 英文摘要 | PURPOSE:To improve an adhesive agent in its heat conduction for the prevention of heat generating parts from heat-caused deterioration by a method wherein a material excellent in heat conductivity is added to the adhesive agent participating in the heat-dissipation structure. CONSTITUTION:Silicone adhesive agents 5 and 14 replace solder between the heat-dissipation elements 2-4 and heat-dissipation fins 6 and between a thickfilm substrate 9 mounted with parts 7 and 8 and the heat-dissipation fins 6. To improve heat conductivity, aluminum nitride (AlN) or silicon carbide (SiC) powder, which is a material equipped with an excellent insulating feature and high heat conductivity, is added to the silicone adhesive agents 5 and 14. In this way, an excellent heat-dissipation capability is attained, and cooling is effectively accomplished of heat-generating parts. |
| 公开日期 | 1996-03-29 |
| 申请日期 | 1987-03-06 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34819]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 株式会社日立製作所 |
| 推荐引用方式 GB/T 7714 | 藤野 裕代,高橋 実,金井 紀洋士,等. 発熱体の放熱構造. JP1996034273B2. 1996-03-29. |
入库方式： OAI收割
来源：西安光学精密机械研究所
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