半導体レーザ装置用サブマウント
文献类型：专利
| 作者 | 服部 亮 |
| 发表日期 | 1996-03-27 |
| 专利号 | JP1996031654B2 |
| 著作权人 | 三菱電機株式会社 |
| 国家 | 日本 |
| 文献子类 | 授权发明 |
| 其他题名 | 半導体レーザ装置用サブマウント |
| 英文摘要 | PURPOSE:To decrease an electrical short-circuit between electrodes in occurrence rate so as to realize a bonding excellent in efficiency by a method wherein a solder flow preventing groove is provided between electrodes patterns which are provided onto a submount. CONSTITUTION:When a two-point light emitting type semiconductor laser device is bonded to a submount, solder is prevented from flowing by solder flow preventing grooves 4 and 5 and a solder flow preventing dike 6, so that the occurrence of an electrical short circuit due to solder outflows 31 and 32 is remarkably restrained. Moreover, the top of the solder flow preventing dike 6 can be higher than the faces of the electrode patterns 2 and 3. And, the most adequate width and depth of the solder flow preventing grooves 4 and 5 are 5-100mum and 5-150mum respectively. And, two or more solder flow preventing grooves can be provided, and if the solders overflowing from both junctions are not merged and contacted with each other, a single groove will do as well. |
| 公开日期 | 1996-03-27 |
| 申请日期 | 1987-11-25 |
| 状态 | 失效 |
| 源URL | [http://ir.opt.ac.cn/handle/181661/34835]  |
| 专题 | 半导体激光器专利数据库 |
| 作者单位 | 三菱電機株式会社 |
| 推荐引用方式 GB/T 7714 | 服部 亮. 半導体レーザ装置用サブマウント. JP1996031654B2. 1996-03-27. |
入库方式： OAI收割
来源：西安光学精密机械研究所
浏览0
下载0
收藏0
其他版本
除非特别说明，本系统中所有内容都受版权保护，并保留所有权利。